Company Flyer
Flyer Broadband SMD
Flyer LED-Chip
Flyer SMDs
Flyer SWIR LED
Flyer UV-Emitters
Development begins with the selection of the specific wafer material. Through our photolithography, we define the special contact layout and the special chip dimensions according to customer requirements.
The chip design defines the emitting areas. This applies equally to the chips in the high-power range and to our small display chips – miniature displays that can display any symbols and digits at the customer’s request.
The processed chips are separated after 100% measurement on the wafer saw. A high-speed spindle equipped with an extremely thin diamond blade is used for this purpose.
The perfect case fulfills several functions. It protects the chip and bonding wire, ensures efficient light extraction and optimal thermal management for reliable operation and long life.
Our chips can be bonded with either gold or aluminum wire. For high power chips, multiple bonds ensure efficient operation at high currents.
The potting makes a significant contribution to efficient light extraction. We use epoxy or silicone depending on the wavelength range and application.
Black potting materials can also be used for special beam forming requirements.
The beam shaping of the light can be decisively influenced by the use of a lens. That is why SMDs with lens are one of our standard products. In addition, glass lenses or lens arrays can be used for customized products.
