CoB Green,Research project in cooperation with ZIM and BMWK

Project Content:

In the chip-on-board process, the LED chips are placed directly on the PCB and contacted by means of bonding wires. The process offers a high degree of flexibility, best positioning accuracy and enormous potential for miniaturization, thermal management and integration. In addition to the LED chips, drivers and/or evaluation electronics or NTCs can also be integrated on the module. The chips are also usually protected by optical encapsulation or a glass cover.

Wir entwickeln Testsysteme mit integrierter Messtechnik und Software zur Qualitätssicherung von optoelektronischen Produkten im Kundenauftrag.
We develop test systems with integrated measurement technology and software for the quality assurance of optoelectronic products on behalf of our customers.