Paleklag,Research project in cooperation with ZIM and BMWK

Project Content:

In the chip-on-board process, the LED chips are placed directly on the PCB and contacted by means of bonding wires. The process offers a high degree of flexibility, best positioning accuracy and enormous potential for miniaturization, thermal management and integration. In addition to the LED chips, drivers and/or evaluation electronics or NTCs can also be integrated on the module. The chips are also usually protected by optical encapsulation or a glass cover.

We develop test systems with integrated measurement technology and software for quality assurance of optoelectronic products on customer order.
We manufacture customer-specific control boards for different flexible operating states for modified LED control.