Innovative solutions
for your applications with a focus on quality, reliability and service.The EPIGAP OSA Photonics GmbH has established itself as a leading manufacturer of LED chips and LEDs, supplying a wide range of industries.
Among other things, our products are used in medical and safety technology as well as industrial sensor technology. LEDs are integrated in many everyday products and stand for energy efficiency and miniaturization. Our special components are additionally characterized by durability and customer specificity and are thus an essential part of many high-end products.
LED Chip Manufacturing
Starting from epiwafers of different sizes, we manufacture high quality LED chips in the wavelength range 600nm – 1100nm.
A typical process flow includes, for example:
- Material logistics, selection and procurement of raw materials and semi-finished products/wafers
- Fitting and incoming goods inspection
- Pre-selection of wafers according to desired target specification
- Metallization
- Photolithographic structuring
- Dicing
- Fully automatic final measurement and selection
Thanks to extensive documentation, we are able to trace each delivery lot back to the wafer if required. In any case, a 100% final measurement of electrical and optical parameters as well as an optical inspection is performed. Customer-specific selection criteria are possible.
SMD Manufacturing
The SMD division manufactures surface mount LEDs in standard and special packages on fully automated machines. The range includes PCB-based standard components, ceramic high-power components as well as various multichip solutions. With a wavelength range offered from 255nm to 1650nm, the entire available spectrum is covered. Due to a flexible machine park, quantities from a few 100 LEDs up to several million components are possible.
Typical process steps include:
- Material logistics (raw material and component procurement, bin selection of chips)
- Incoming goods inspection and bin correlation measurement
- Automatic chip bonding (silver epoxy, AuSn solder, flip chip)
- Automatic wire bonding
- Encapsulation (silicone or epoxy encapsulation, positioning of lenses or glass caps)
- Dicing
- Automatic end measurement and binning
- Package (Tape & Reel)
Extensive documentation enables complete traceability of the chips used (down to the wafer in the case of proprietary chips). All products have a 100% final measurement of electrical and optical parameters. Customized binning even in narrow binning classes is possible.
Chip on Board Manufacturing
Only customer-specific modules are manufactured in the Chip on Board production area. Due to a large technological breadth as well as the interaction of manual and automatic processes, we are able to react flexibly to your request within a short time. Production takes place in ISO Class 7 clean rooms at the Berlin site.
A selection of our technological capabilities and processes:
- Material logistics (raw material and component procurement)
- Goods receipt and pre-selection of components and bins
- Soldering process (SMD and THT assembly)
- Chip bonding (manual and automatic, flip chip)
- Wire bonding (gold and aluminum wire, manual and automatic)
- Encapsulation (hermetic sealing by means of electrode welding, potting, globtop)
- Assembly of optical components (cover glasses, filters, lenses)
- Burn-In
- Final testing and qualification
- Packaging (tape & reel, trays) and delivery logistics
The focus of module production is on OEM modules for medical technology/biophotonics, industrial applications/sensor technology and safety technology. Continuous documentation ensures traceability of the materials used. Special requirements for material selection (e.g. biocompatibility according to DIN EN ISO 10993), assembly processes or qualification and documentation (e.g. serialization with individual measurement report per module) are possible after consultation.
Made in Berlin.
Sie finden uns im grünen Vorort
von Köpenick im Innovationspark Wuhlheide
