EPIGAP OSA Photonics GmbH develops and produces state-of-the-art LED chips, SMD LEDs and customized LED modules in Berlin.

Competent development services In the packaging technology sector, semiconductor chips are precisely assembled and hermetically sealed. Competent development services are combined with a deep understanding of complex manufacturing processes to take products from initial prototypes to production readiness.Our flexible in-house manufacturing in multiple ISO Class 7 to 5 cleanrooms is designed to accommodate different sized production runs. We are able to guarantee short development cycles as well as an uncomplicated series transfer. Throughout the entire process, development is geared towards cost-optimized production under the highest quality requirements. The vertically integrated structure of the EPIGAP OSA Photonics Group enables us to optimally coordinate all components and processes along the entire value chain. In-house semiconductor manufacturing also provides more secure access to core components as well as deep subject matter expertise.

Fully monitoring along the entire value chain:

Casting and lens assembly

Light extraction can be fine-tuned by the placement of the lens or specific casting technology in SMDs or TO-can assemblies. In addition, glass lenses or lens arrays can be used for customized products.

Our own production in Germany enables us to deliver customer-specific products in consistent quality for years.

EPIGAP OSA Photonics GmbH develops customized optoelectronic solutions for you and with you.

Focal points of our development offer

• LED chip development (special geometries, point sources, monolithic display chips)
• Device development (SMD LEDs, special designs, multichip)
• Matched phosphor conversion (broadband emitter)
• Optoelectronic modules (LED and sensor modules in chip-on-board and hybrid technology)
• Process development for adapted chip and packaging technology

Our customized products

If our standard products are not the right solution for your application, we will be happy to make adjustments or develop a fully customized product.

For your customized solution our offer includes:

• Adaptation of standard designs (specification limitations, matched package-chip combinations)
• Development of customized components on chip and component level (SMD and TO)
• Development of individual modules

On the way to your perfect product we take over in coordination with you e.g.:

• Definition of optoelectronic targets (spectrum, peak WL, power and corresponding binning).
• Selection of a suitable substrate material (PCB, ceramic, IMS, Flex…)
• Layout and design of the overall module
• Optics simulation
• Sample construction
• Qualification and testing
• Series production

As a manufacturing company, our focus is on a design for manufacturing. Already during development, our engineers always keep an eye on the economic implementation for series production as well as the availability of the materials used.

Typical process of a customer-specific module or component development

• Matching requirements and opportunities

A typical development process consists of the following steps, although not all of them are mandatory.
After you have formulated your technical requirements to us and any queries have been clarified, we will submit a quotation to you.

• Offer with detailed specifications and order

Our offer includes a specification sheet, which contains a detailed schedule in addition to the technical specification.

• Kich-Off Meeting

After your order, a kick-off meeting will take place (online if necessary). From this point on, in addition to your sales contact, a technical project manager will be available to answer any questions you may have.

• Regular reconciliation

During the development process, your contacts will provide you with regular updates.

• Release for sample production

After completion of the design phase, you will receive the technical documentation for approval. Once approval has been given, prototype production begins. These are tested to the agreed extent after production.

• Sample production and testing (EMPB)

The samples are delivered together with an initial sample test report summarizing the results. At this point, you will also receive feedback on where there is still potential for optimization from a production perspective.

• Customer release, optimization and series production

After the samples have been approved by you and any necessary optimizations have been made, they are transferred to series production.

We take care of your entire supply chain. For all components and assemblies supplied by us, we take over the procurement of the defined materials, ensure perfect quality and on-time delivery.
Stocking of critical components and materials
Response to supply bottlenecks by several suppliers
Early announcement of discontinuations incl. Replacement proposal
Verification of conformity with current (environmental) standards
One Stop solution: one contact person enables time and cost savings for the customer

The development of components and parts for the highest quality demands is only possible with accompanying qualification and extensive testing. In addition to our automated series measurement technology, a wide range of specialized measurements and qualifications can be performed in our central measurement laboratory.

A coordinated test and measurement program is used in series production. This is defined during development and in close consultation with the customer. Common tests include, for example:

• fully automated measurement of radiant intensity, peak wavelength, spectrum and derived quantities as well as electrical characteristics on chip as well as on device level
• Visual inspection and quality testing based on defect catalogs
• Leak test on capped components (fineleak, grossleak)
• Bond quality testing, pull test, shear test
• Binning according to customer requirements

Burn-In

All measurement data can be stored in a database and processed for statistical evaluation. After consultation, you will receive the information relevant to you in a suitable form (chain of custody, measurement protocols, complete data in digitally evaluable form). Before the start of series production, development is accompanied by a coordinated qualification process. Depending on the requirements, various processes are possible:

• Electro-optical characterization (spectral measurements between 200nm and 2500nm)
• Power measurements in cw and pulse mode
• Characteristic curve recording
• Pulse duration measurement
• Radiation behavior (goniometric measurement)
• Lifetime/Degradation
• All tests are possible on chip as well as on component level.
• All tests can be performed depending on the temperature.

All tests can be performed depending on the temperature. These include:

• Temperature cycling tests -40°C to 150°C
• Damp heat according to DIN EN / MIL
• Pull test
• Shear Test
• ESD Human Body Modell

Other methods: Cross-section preparation, optical microscopy, scanning electron microscopy with EDX.