Services

customized optoelectronic solutions

Chip Fabrication

  • Lithography
  • Metalization, Etching
  • Wafer dicing
  • Wafer mapping
  • Chip binning
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Photonic Assembly

  • Chip Bonding
  • Pick and place
  • Wire-Bonding
  • Encapsulation
  • SMD and TO packaging
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 Test & Qualification

  • Characterization
  • Optical, Electrical, Pulsed
  • Burn-in and reliability
  • Enviromental test
  • Supply chain support
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Research & Development

  • Optical Design
  • Mechanical Design
  • Electrical Design
  • Prototyping
  • Product Development
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Person placing wafer in a semiconductor manufacturing machine

Chip Fabrication

Lithography, Metalization, Etching
Dicing, Mapping, Binning

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Wirebonded chips

Photonic Assembly

Pick and Place, Wire-Bonding, Encapsulation, Chip on Board, SMD and TO packaging

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Semiconductor machine

Test & Qualification

LEDs and PDs, Burn-in and Reliability, Enviromental Tests, Supply Chain Management

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R & D

Optical, Mechanical and Electrical Design, Prototyping, Product Development

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Chip Fabrication

Our chip fabrication services cover all essential stages of processing, from lithography to wafer-level characterization. We work with a wide range of semiconductor materials and advanced process technologies.

Semiconductor Wafer Processing

Processing of 2” to 4” wafers for LEDs, point sources, photodiodes, and monolithic displays using high-quality compound semiconductor materials.

  • 2-4” wafer proces: LEDs, point sources, displays
  • GaAs / AlGaAs / InGaAs processing
  • Photolithography for microstructures
  • Wet etch and cleaning
  • Metal deposition: Au, Au alloys, Pt, etc.
  • Thin film deposition and annealing
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Chip manufacturing metalization process
chips lying on bluetape

Wafer dicing & sawing

High-precision dicing ensures minimal edge damage and accurate chip dimensions.

  • Down to 250 µm pitch
  • Dicing of semiconductor and ceramic materials
Semiconductor machine

Wafer Mapping

Comprehensive mapping allows us to grade and select dies based on performance across the wafer.

  • LED, VCSEL mapping (up to 6”)
  • PD dark-current and photo-current mapping
  • Fiber-coupled spectrum testing
  • Dark current and photocurrent mapping
person holding an led chip with tweezers

Chip sorting and binning

We ensure accurate binning for intensity, spectral characteristics, and electrical parameters.

  • Pre-selection before packaging (SMD, THT)
  • LED bins based on CIE 127:2007 standard
  • Tape and reel options

Photonic Assembly

Our advanced assembly processes support a wide range of packages—from custom SMD layouts to hermetic TO-cans, multichip assemblies, lens integration, and optomechanical customization are available.

Chip Bonding / Pick and Place

We support flexible and high-precision bonding of various chip types and substrates. We place components on indicidual packages or utilizing flexible Chip-ob-Board (CoB) processes.

  • Multichip assemblies with 20+ components
  • Minimum die size of 250um
  • Placement accuracy down to +-10 µm
  • Manual and automatic die attach
  • Substrates: FR4, flex PCB, IMS (Insulated Metal Substrate), ceramics, TO
  • Alignment using ULC (Upward-Looking Camera) systems
  • Die Attach Options
    • Flip-Chip, CoS (Chip on Submount) soldering
    • Soldering with AuSn preforms or Sn-Ag-Cu alloys
    • Vacuum soldering (low and high temp) 
Chip bonding machine
Wirebonded chips

Wire-Bonding

Our wire bonding services offer reliability for both high-frequency and high-current applications.

  • Manual and automatic machines
  • Gold wire: 17 µm / 25 µm / 30 µm
  • Ball-wedge and wedge-wedge bonding
  • Bumping techniques: Bond Stitch On Ball (BSOB), Safe Bump
  • Large automated working area
  • Pull and shear testing per MIL standards
Display chip

Encapsulation

Protective and optical encapsulations are available over a wide spectral range.

  • Flat, dam & fill, glob top, lensing encpsulation
  • Materials: clear, red, green, blue, black (light-blocking)
  • Light phosphor conversion materials for White LEDs or NIR emission
  • Custom conversion materials
  • AR coatings and optical filters (e.g., bandpass)
THT TO-can LEDs photo

TO Packaging

Hermetically sealed TO-cans for high-reliability applications and sensor modules.

  • Large selection of TO sizes: up to TO-3
  • Multichip and multi-element integration
  • Custom caps: lens, flat window, AR coating, filters
  • Assembly under inert or dry atmosphere (e.g. nitrogen, trimix)
  • Optional TEC integration
Surface Moutable LEDs

SMD Packaging

We design and manufacture SMD assemblies to fit standard or custom footprints with a high level of automation.

  • Substrate flexibility: FR4, PLCC (Plastic Leaded Chip Carrier) and ceramics
  • Flexible encapsulation
  • Epoxy and glass lens placement
  • 100% automatic testing accroding to CIE norm
  • Tape and reel packaging
  • Full SMT line: stencil printing, reflow soldering, 8 mm tape feeder

Test and Qualification

We provide full-spectrum testing of optoelectronic components—covering electrical, optical, reliability, and environmental performance.

Enviromental and Lifetime Tests

Ensure long-term reliability of your products through accelerated stress tests.

  • Real time power monitoring
  • Accelerated aging and reliability tests
  • Multi-chip SMD reliability testing
  • Humidity and temperature enviroemental test
  • Temperature cycling
SMD LEDs with lens
light emitting diode tested under needles

Manual and Automatic LED testing

All components undergo rigorous electrical and optical testing—automated where possible.

  • LED, photo-diode, laser diode characterization
  • Electrical and optical properties
  • 100% CIE-compliant testing
  • Angular radiation pattern measurements
TO cans

Pulsed and high-frequency studies

We test high-speed and high-current operation characteristics for demanding applications.

  • Pulsed measurement (up to 5A)
  • High-frequency characterization (kHz–GHz)
tape with LEDs

Lifetime product support

Beyond testing, we support your product throughout its lifecycle.

  • Component storage and material tracking
  • Inventory and supply chain management
  • Qualification services
  • Failure analysis

Research, Development and Prototyping

We offer comprehensive R&D services based on our expertise in LED and optoelectronic component manufacturing and packaging, to support the design, prototyping, and development of next-generation optoelectronic products.

Optical design

Simulation and optimization of custom optical systems and light sources.

  • LED optical system simulation
  • Material loss and optical path analysis
  • Light conversion materials design and selection
PCB board with LEDs
PCB board with LEDs

Mechanical and electrical design

We engineer complete solutions, from chip-level design to system integration.

  • LED chip selection and configuration
  • Custom packaging and enclosure design
    • Substrates: PCB, Flex, ceramics
  • Material matching and thermal expansion control
  • Component specification and BOM (Bill of Materials) optimization
Display chip

Prototyping

From concept to early-stage production, we enable rapid development of working systems.

  • LED-based products design and prototyping
  • Small batch production for testing and demonstration
  • Series production, qualification
UV SMD LED

R & D Services

We proudly participate in collaborative innovation projects and consortia.

  • Publicly and privately funded research initiatives
  • Joint development with universities and institutes
  • Commercialization of innovative technologies
  • Providing path towards mass manufacturing