Funding Projects
Overview our research projectsFunded by the Berlin program for fostering research, innovation, and technology – Pro FIT. This project is co-funded by the European Fund for regional development.

Cost-efficient gas sensor system based on wavelength-tunable quantum dot VCSEL arrays (QD-Sense)
The aim of the project is the development of an innovative and cost efficient, highly precise and highly reliable spectroscopic system that is able to detect in-situ and extractive very low hydrogen vapor concentrations in industrial applications. The innovative project idea is based on wavelength controllable VCSEL arrays.
Berlin based project partner: Technische Universität Berlin, JCMwave GmbH, EPIGAP OSA Photonics GmbH und eagleyard Photonics GmbH.
This project is a project in the framework of the 5th Berlin-Brandenburg – Polish Call “Photonics, microelectronics and quantum technologies as key enabling technologies for the digital transformation, energy transition, smart mobility and life sciences“.
UV-Multiy
Aim of the project is the development of epitaxy and chip technology for the production of durable far uvc LEDs and the development of a multi wavelength uv LED module. These novel modules will emitt radiation of 227 nm, 285 nm, and 390 nm for applications in gas sensors for the detection of nitrogen monoxide, sulfur dioxide, and nitrogen dioxide.
Project partner: Ferdinand-Braun-Institut gGmbH Leibniz-Institut für Hoechstfrequenztechnik and EPIGAP OSA Photonics GmbH.
Funded within the framework of the Central Innovation Program for SMEs (ZIM) of the Federal Ministry of Economics and Climate Protection (BMWK)

Panel-level manufacturing of hermetic glass-ceramic enclosures (PaLeGlaK)
Funded within the framework of the Central Innovation Program for SMEs (ZIM) of the Federal Ministry of Economics and Climate Protection (BMWK)
UV LEDs offer a wide range of applications from disinfection to spectroscopy and illumination, but remain a challenging development topic with good to very good market potential. Conventional LED packaging technologies are not sufficient here. The components are still very expensive and are also sensitive to moisture and possibly oxidizing gases such as oxygen and hydrogen sulfide. Since these light sources are used extensively in fresh and process water treatment, the environment does not provide protection from these influences, but rather brings them into close proximity to the components. Individual enclosure technologies exist for hermetically sealing the components, but these lead to further increases in the price of the already expensive semiconductors.
This is where PaLeGlaK comes in. By appropriately choosing ceramic and glass plates that are patterned and metallized, dozens of devices can be hermetically or quasi-hermetically assembled in larger areas in a single step and then singulated without contaminating the semiconductor. This type of panel level assembly of both substrate (ceramic) and cap (glass), is new and needs to be developed.
Project partners: Technical University of Berlin and EPIGAP OSA Photonics GmbH.
CoB Green, Research project in cooperation with ZIM and BMWK
In the chip-on-board process, the LED chips are placed directly on the PCB and contacted by means of bonding wires. The process offers a high degree of flexibility, best positioning accuracy and enormous potential for miniaturization, thermal management and integration. In addition to the LED chips, drivers and/or evaluation electronics or NTCs can also be integrated on the module. The chips are also usually protected by optical encapsulation or a glass cover.
Wir entwickeln Testsysteme mit integrierter Messtechnik und Software zur Qualitätssicherung von optoelektronischen Produkten im Kundenauftrag.
We develop test systems with integrated measurement technology and software for the quality assurance of optoelectronic products on behalf of our customers.