Photonic Assembly
Design and packaging services, custom SMD or chip-on-board productionEPIGAP OSA Photonics GmbH offers one-stop semicoductor manufacturing and assembly services:
We provide in-house chip manufacturing, SMD production and multi-chip assembly services. Our customers engage us starting at the design phase of the product development up to supply management for legacy products. Our customers come from medical, industrial and defence industries. Our ability to work with optoelectronics operating from deep ultraviolet to far infrared makes us a unique partner for any product category.
Each customization project is unique. Please don’t hesitate to contact our sales and engineering team to discuss your application: sales@epigap-osa.de
For your customized solution our offer includes:
- Adaptation of standard designs (specification limitations, binning, matched package-chip combinations)
- Development of customized products at chip and component level (SMD or TO)
- Development of individual modules, including mechanical, electrical and software design
- Advanced characterization, reliability testing
- Product support over the whole product lifetime, including supply chain management, product replacement strategy and many more…


Our manufacturing chain at one glance:

Chip design
Development begins with the selection of the specific wafer material for chip production. Then we design a lithography mask according to the requirements

Chip manufacturing
In our semiconductor manufacturing facility we can apply different processes needed for chip manufacturing. We can manufacture LEDs, point sources and monolithic displays.

Chip dicing and handling
The processed chips are separated with a precise diamond saw after 100% mapping. After this the chips can be automatically pre-selected and picked to bluetape or gelpack.

Package design and selection
Each application has specific lgiht extraction, footprint, temperature and mechanical stability requirements. We have capability to select the right package for the application, perform optical or mechanical design accessment or design a completely custom package.

Wirebonding
Any assembly begins with wirebonding of the chip to the submount. Our chips can be bonded with either gold or aluminum wire. For high power chips, multiple bonds ensure efficient operation at high currents.

Casting and lens assembly
Light extraction can be fine-tuned by the placement of the lens or specific casting technology in SMDs or TO-can assemblies. In addition, glass lenses or lens arrays can be used for customized products.
Our focus is on optimizing a design for manufacturing. During the development cycle, our engineers always keep an eye on the most economical solution that meets the customer’s requirements while also considering the life cycle aspects of the raw materials used.
On the way to your perfect product we take over in coordination with you e.g.:
- Definition of optoelectronic targets (spectrum, peak WL, power and corresponding binning).
- Selection of a suitable substrate material (PCB, ceramic, IMS, Flex…)
- Layout and design of the overall module
- Optics simulation
- Sample construction
- Qualification and testing
- Series production
Competent development services
In the packaging technology sector, semiconductor chips are precisely assembled and hermetically sealed. Competent development services are combined with a deep understanding of complex manufacturing processes to take products from initial prototypes to production readiness.Our flexible in-house manufacturing in multiple ISO Class 7 to 5 cleanrooms is designed to accommodate different sized production runs. We are able to guarantee short development cycles as well as an uncomplicated series transfer. Throughout the entire process, development is geared towards cost-optimized production under the highest quality requirements.
The vertically integrated structure of the EPIGAP OSA Photonics Group enables us to optimally coordinate all components and processes along the entire value chain. In-house semiconductor manufacturing also provides more secure access to core components as well as deep subject matter expertise.
- Semiconductor chip design, module design, optics simulation, mechanical design and supply logistics
- LED chip prototyping
- Prototyping of optoelectronic components, modules and assemblies
- Test and qualification
- Series production
Our own production in Germany enables us to deliver customer-specific products in consistent quality for years.