Career

Description of professional activities / tasks:

• Regeneration of worn molds by burn-off of working molds
• Cleaning and inspection of burned-off working molds
• Cleaning and inspection of master molds using a microscope
• Production and maintenance of working molds made of silicone
• Production of silicone backings as matching counterparts to the working molds
• Care and maintenance of tools, equipment, and the workplace

General tasks:

• Compliance with personal occupational safety requirements, especially when working on machines
• Responsibility for cleanliness at machines and workstations
• Responsibility for monitoring minimum stock levels of specified materials, tools, and auxiliary supplies
• If required, responsibility for the proper use of workshop machines
• Compliance with the requirements of ISO 9001 and the corresponding internal documentation, especially work instructions and forms
• Participation in implementing the quality policy and achieving company goals
• Performance of additional tasks as required by operational needs, provided the necessary aptitude, qualifications, and training are in place

Professional requirements:

Formal vocational training is not strictly required, but desirable. The activity itself will be taught on the job.

• High level of concentration for manual work and inspection work under a microscope (fine motor manual activities)
• Ability to reliably recognize technical interrelationships and process deviations
• Appropriate qualifications
• High level of manufacturing discipline and reliability
• Careful and clean handling of chemicals

Personal requirements:

• Suitability for work under semiconductor manufacturing conditions
• Appropriate personal and physical fitness
• Ability to work in a team
• Ability to handle conflict
• Quick comprehension
• Mental flexibility
• Confident demeanor
• Organizational skills

Description of professional activities / tasks:

• Die bonding and wire bonding
  • Operating the bonders, including switching on, setup, and switching off
  • Taking released materials such as adhesives and printed circuit boards / ceramics from storage
  • Changing programs
  • Monitoring the process
  • Documentation on accompanying documents and in the ERP system
• Related tasks
  • Curing / tempering
  • Plasma etching
• Assembly of lenses and other components
• Quality control
  • Incoming goods inspection of materials
    • Printed circuit boards and ceramics
    • Conductive adhesive, adhesive, and bonding wire
    • Chips (inspection of the foils for tension, assignment to the batch, and clear labeling)
    • Preparation of approvals by sample fitting according to work instructions
  • Post-bond inspection by means of
    • Visual inspection
    • Measurement of pull and shear values
• Carrying out additional tasks as required by operational needs, provided the necessary suitability, qualifications, and training are available
• Maintenance
  • Care and maintenance of work equipment and workstations
  • Cleaning of workstations and machines in accordance with maintenance regulations and instructions

General tasks:

• Compliance with personal occupational safety requirements, especially when working on machines
• Responsibility for cleanliness at machines and workstations
• Responsibility for monitoring minimum stock levels of specified materials, tools, and auxiliary supplies
• If required, responsibility for the proper use of workshop machines
• Compliance with the requirements of ISO 9001 and the corresponding internal documentation, especially work instructions and forms
• Participation in implementing the quality policy and achieving company goals
• Performance of additional tasks as required by operational needs, provided the necessary aptitude, qualifications, and training are in place

Professional requirements:

Formal vocational training is not strictly required, but desirable. The activity itself will be taught on the job.

• Ability to maintain a high level of concentration during manual work and inspection tasks under a microscope (fine motor manual activities)
• Ability to reliably recognize technical relationships and process deviations
• Appropriate qualifications
• High level of production discipline and reliability
• Careful and clean handling of chemicals

Personal requirements:

• Suitability for work under semiconductor manufacturing conditions
• Appropriate personal and physical fitness
• Ability to work in a team
• Ability to handle conflict
• Quick comprehension
• Mental flexibility
• Confident demeanor
• Organizational skills

YOUR TASKS
– Manufacturing of semiconductor chips by patterning, etching, doping and sawing
– Further processing of semiconductor chips by assembly, soldering, bonding and encapsulation to electronic components
– Metrological evaluation of the components
– Design and evaluation of circuits as well as microsystems

CONTENT AND DURATION OF THE APPRENTICESHIP
– 3 years (shortening possible with appropriate performance) | Start on September 1 each year
– Dual apprenticeship (school-based and in-company)
– Vocational School Chemistry, Physics and Biology (Lise – Meitner – Schule) in Berlin
– Company EPIGAP OSA Photonics GmbH in the Innovation Park Wuhlheide (Berlin)
– Payment: 1st apprenticeship year 940€ | 2nd apprenticeship year 990€ | 3rd apprenticeship year 1.050€ + ticket

WHAT YOU SHOULD BRING WITH YOU
– Interest in science subjects because microtechnologists perform the following tasks, among others:

Physics – measuring voltages, currents, resistances, etc.

Chemistry – Handling of acids, alkalis and other chemicals
Mathematics – planning, set-up and statistical evaluation of measurement series or machine parameters ( e.g. etch rate, layer thickness)
– manual as well as fine motor skills
– acting responsibly and prudently
– Eye for detail

YOUR TASKS
– Assembly of machine tools and devices
– Fault detection and rectification
– Replacing wearing parts
– Maintenance of machines
– Installation of control systems
– Programming of complex systems

CONTENT AND DURATION OF TRAINING
– 3.5 years (shortening possible with appropriate performance) | Start on September 1
– Dual training (school-based and company-based)
– Secondary school for mechanical and production engineering (Georg-Schlesinger-Schule) in Berlin-Reinickendorf
– Company EPIGAP OSA Photonics GmbH in the Wuhlheide Innovation Park (Berlin)
– Remuneration. 1st year 940€ | 2nd year 990€ | 3rd year 1.050€ | 4th year 1.150€ + BVG ticket

WHAT YOU SHOULD BRING WITH YOU
– An interest in technical systems and their repair
– Good technical and mathematical understanding
– Manual skills
– Analytical thinking
– Careful and independent way of working

YOUR TASKS
– Materials management
Offer comparison | Negotiations with suppliers | Communication with customers
– Sales and marketing
Preparing calculations and price lists | Conducting sales negotiations | Developing various       advertising measures | Managing social media channels
– Finances
Monitoring payment transactions | Checking the amounts due
– Human resources
Determination of personnel requirements | Support with recruitment | Supervision of personnel

CONTENT AND DURATION OF THE APPRENTICESHIP
– 3 years (shortening possible with appropriate performance) | Start on September 1
– Dual training (school-based and company-based)
– Oberstufenzentrum Wirtschaft (Leopold-Ullstein-Schule) in Berlin-Wilmersdorf
– Company EPIGAP OSA Photonics GmbH in the Wuhlheide Innovation Park (Berlin)
– Remuneration. 1st year of apprenticeship 940€ | 2nd year of apprenticeship 990€ | 3rd year of apprenticeship 1,050€ + BVG ticket

WHAT YOU SHOULD BRING WITH YOU
– Good knowledge of math, German and English
– Good written and spoken communication skills
– Interest in commercial and organizational activities and processes
– Analytical thinking
– Careful and independent way of working